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Typical Thermal Characteristics
18
15
V DS = -5V
T J = -55°C
3 .5
3
1a
12
9
6
25°C
125°C
2 .5
2
1 .5
1b
3
1
1c
4.5"x5" FR-4 Board
o
T A = 25 C
Still Air
2 o z COPPER M O U N T ING PAD AREA (in )
0
0
-2
-4 -6
I D , DRAIN CURRENT (A)
-8
-10
0 .5
0
0 .2 0 .4 0 .6 0 .8
2
1
Figure 13. Transconductance Variation with Drain
Current and Temperature.
10
Figure 14. SOT-223 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad
Area.
40
100
1m
8
1a
20
10
R
DS
(O
N)
LIM
IT
s
us
1 0 m
1s
6
4
2
1c
1b
4.5"x5" FR-4 Board
o
T A = 25 C
Still Air
3
1
0.3
0.1
0.03
V GS = -10V
SINGLE PULSE
R θ JA = See Note 1c
T A = 25°C
1 0 0 m
10s
DC
s
s
V GS = -10V
0
0
0.2
0.4
0.6
0.8
1
0.01
0.1
0.2
0.5
1
2
5
10
30
50
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
1
- V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 16. Maximum Safe Operating Area.
0 .5
D = 0.5
(t) = r(t) * R JA
θ JA
θ
R JA = See Note 1 c
0 .2
0 .1
0 .05
0 .02
0 .2
0 .1
0 .0 5
0 .0 2
P(p k)
R
θ
0 .01
0 .0 1
t 1
t 2
T J - T A = P * R JA (t)
0 .0 0 5
0 .0 0 2
0 .0 0 1
Single Pulse
θ
Duty Cycle, D = t 1 / t 2
0 .0 0 0 1
0 .0 0 1
0 .01
0 .1
1
10
100
300
t 1 , TIM E (sec)
Figure 17. Transient Thermal Response Curve .
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal
response will change depending on the circuit board design.
NDT456P Rev. F
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